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| 微量Co对低银无铅焊料润湿及界面反应的影响 | |
| 引用本文： | 王宏芹,王玲,符永高,张新平.微量Co对低银无铅焊料润湿及界面反应的影响[J].电子元件与材料,2010,29(7). |
| 作者姓名： | 王宏芹 王玲 符永高 张新平 |
| 作者单位： | 1. 华南理工大学材料科学与工程学院,广东广州,510640;中国电器科学研究院,广东广州,510300 2. 中国电器科学研究院,广东广州,510300 3. 华南理工大学材料科学与工程学院,广东广州,510640 |
| 基金项目： | 中国博士后基金资助项目，广东省自然科学基金博士启动基金资助项目，华南理工大学博士后创新基金资助项目 |
| 摘 要： | 利用润湿测量仪研究了加入微量Co对低银无铅焊料Sn1.00Ag0.70Cu和Sn0.50Ag0.70Cu润湿性能的影响,并与共晶无铅焊料Sn3.00Ag0.50Cu的润湿性能进行对比。结果发现,焊料Sn3.00Ag0.50Cu、Sn1.00Ag0.70Cu0.07Co和Sn0.50Ag0.70Cu0.03Co的润湿平衡力F分别为3.0850,3.0600和3.0275mN,润湿时间分别为0.64,0.88和1.01s。低银微钴无铅焊料显示了与共晶无铅焊料类似的润湿力,只是润湿时间略有增加。 |
| 关 键 词： | 低银无铅焊料 Co 焊接性能 |
Effect of Co addition on the wetting and interfacial reaction between lead-free solder with low Ag content and Cu substrate |
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| WANG Hongqin,WANG Ling,FU Yonggao,ZHANG Xinping.Effect of Co addition on the wetting and interfacial reaction between lead-free solder with low Ag content and Cu substrate[J].Electronic Components & Materials,2010,29(7). | |
| Authors: | WANG Hongqin WANG Ling FU Yonggao ZHANG Xinping |
| Abstract: | The wetting properties of the low silver lead-free solders Sn1.00Ag0.70Cu and Sn0.50Ag0.70Cu with the micro addition of Co were investigated with the wetting tester and SEM in comparison with the eutectic solder Sn3.00Ag0.50Cu. Results show that the wetting balance forces (F) of the Sn3.00Ag0.50Cu, Sn1.00Ag0.70Cu0.07Co and Sn0.50Ag0.70Cu0.03Co are 3.085 0, 3.060 0 and 3.027 5 mN, respectively, while the wetting times are 0.64, 0.88 and 1.01 s, respectively. These low Ag lead-free solders with the micro addtion of Co have similar wetting balance forces as that of the eutectic solder Sn3.00Ag0.50Cu, only some difference exsiting in the wetting times. |
| Keywords: | Co |
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