Low-temperature plasticity in nanocrystalline titanium and copper

The stress-strain compressive curves, temperature dependences of the yield stress, and small-inelastic-strain rate spectra of coarse-grained and ultrafine-grained (produced by equal-channel angular pressing) titanium and copper are compared in the temperature range 4.2–300 K. As the temperature decreases, copper undergoes mainly strain hardening and titanium undergoes thermal hardening. The temperature dependences of the yield stress of titanium and copper have specific features which correlate with the behavior of their small-inelastic-strain rate spectra. Under the same loading conditions, the rate of microplastic deformation of ultrafine-grained titanium is lower than that of coarse-grained titanium and the rate peaks shift toward high temperatures. The deformation activation volumes of titanium samples differing in terms of their grain size are (10–35)b ³, where b is the Burgers vector magnitude. The dependences of the yield stress on the grain size at various temperatures are satisfactorily described by the Hall-Petch relation.