| 再流焊温度曲线记录器的研究与应用 |
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| 引用本文： | 常青,郑毅,张小燕. 再流焊温度曲线记录器的研究与应用[J]. 电子工艺技术, 2000, 21(3): 107-109,128 |
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| 作者姓名： | 常青 郑毅 张小燕 |
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| 作者单位： | 信息产业部电子第二研究所山西太原 030024 |
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| 摘 要： | 目前由于QFP和BGA等器件的大量采用 ,如何准确地测试、调整印制板温度曲线是提高焊接质量的关键。本文重点阐述了WJQ - 3温度记录器的结构与工作原理及应用。
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| 关 键 词： | 再流焊 温度曲线 温度记录器 |
| 文章编号： | 1001-3474(2000)02-0107-03 |
Temperature Profile of Reflow system and Datalogging |
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| CHANG Qing,ZHENG Yi,ZHANG Xiao-yan. Temperature Profile of Reflow system and Datalogging[J]. Electronics Process Technology, 2000, 21(3): 107-109,128 |
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| Authors: | CHANG Qing ZHENG Yi ZHANG Xiao-yan |
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| Abstract: | With extensive application of fine pitch QFPs and BGAs,precisely and accurately determining and adjusting PCB's temperature profile is necessary to promote solder quality.This paper introduces the structure and principle of WJQ-3 datalogging as well as its application. |
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| Keywords: | Reflow system Temperature profile Datalogging |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
