Reduction of the concentration of slow insulator states in SiO2/InP-MIS structures

The well-known drift phenomena usually found in the InP-metal-insulator-semiconductor (MIS) devices can be explained by the assumption of a spatial and energetical distribution of slow states located within the insulator. The concentration of these states can be reduced by far more than one order of magnitude if a suitable technique of insulator deposition is applied. In this paper we will discuss the influence of the deposition temperature, the spatial separation of sample and plasma (“indirect plasma method”), and the addition of phosphorus into the reaction chamber during the initial period of insulator deposition on the properties of n-type and p-type InP-MIS capacitors. Plasma-enhanced chemical vapor deposited silicon dioxide is used as insulator. The samples were characterized by means of capacitance/voltage (C(V)) and deep level transient spectroscopy (DLTS) measurements. Only minor hysteresis of the C(V) curves and concentrations of slow insulator states of only (1–2)×10¹¹ cm^-2 eV^-1 are measured for the best of our samples.