低热应力热稳定曲线型阵列波导光栅复用器

相对方形阵列波导光栅波分复用器芯片而言,采用曲线切割的复用器芯片可以成倍地增加单个晶圆上的复用器产出率,但是曲线切割复用器的中心波长更加容易受到热应力的影响,该热应力是由于封装盒与耦合到复用器芯片上的带状光纤之间的线膨胀系数差异所引起的.本文实验分析了封装热应力对复用器中心波长的影响,结果表明,封装热应力与复用器中心波长之间的变化成线性关系.即使采用比较软的硅橡胶将复用器上的带状光纤固定到封装盒上,对于热稳定封装的曲线复用器而言,当环境温度在-20~65℃之间变化时,其中心波长也会有46 pm的变化.通过在热稳定复用器封装用的加热片上贴一片高硼硅玻璃,同时将带状光纤用硅橡胶固定到高硼硅玻璃上的方法,既保证了带状光纤相对封装盒固定,又减小了它们之间线膨胀系数不一致导致的热应力.实验结果表明,在-20到65 ℃温度范围内,这种复用器模块的中心波长高低温变化典型值小于5 pm,而且光纤所受的应力典型值小于0.029 MPa.

Stress-free Thermally Stabilized Curve-shape Arrayed Waveguide Grating Packaging

The yield of curve-shape arrayed waveguide grating (AWG) chips is twice of the square-shape ones. However, the center wavelength of curve-shape AWG is easily influenced by the packaging stress, which is introduced by the linear expansion coefficient difference between the packaging box and the ribbon fibers coupled to the AWG chip. The experimental results showed the AWG center wavelength varied with the thermal stress linearly. The variation of the center wavelength for a thermally stabled AWG module was as large as 46 pm, when the ambient temperature varied from -20 ℃ to 65 ℃, even the ribbon fibers were bonded to the packaging box with soft silicon rubber. In this paper, a new low stress thermal stabled AWG packaging was introduced. In this package, a borosilicate glass plate was bonded to the ceramic heater, and the ribbon fibbers were bonded to it with silicon rubber. For the linear expansion coefficient difference between the borosilicate glass plate and ribbon fiber is very samll, the thermal stress of ribbon fibber or AWG chip is very small. Experimental results showed the typical center wavelength variation for thermally stabled AWG modules manufactured with this technique was smaller than 5 pm, and the typical thermal stress was smaller than 0.029 MPa, when the ambient temperature varied from -20 ℃ to 65 ℃.