Functional evaluation of a liquid-molding two component combination resin |
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Authors: | B. Chowdhury |
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Affiliation: | (1) Matech Associates, 150 E.Grove Street, 18510 Scranton, PA, USA |
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Abstract: | Functional parameters contributing to the recognizable good performance of a highly crosslinked olefinic polymer based on cyclopentadiene have been evaluated by a limited range of stress decay and creep recovery from a fixed deformation over constant time periods. The experimental design for these involved a calculated stress (load) at the initial sample deformation (displacement) for determination of changes in stress in bending mode and flex creep under applied load at three constant temperature segments of 6 h each with 20 min recovery time between segments. The results have identified a behavior which is typical of interfacial orientational effect in a two-component system. Thermal conductivity, heat capacity and density at the same temperatures were measured for determination of variations in thermal diffusivity as an indication of the competing effects of densification and thermal expansion for such a system.Static charging and polarization experiments were performed for evaluation of other desired uses of this material, in moving parts and in direct or induced voltage applications. The latter allows measurement of dynamic charge transport through the resin matrix. Calculations indicate generation of charge carriers from weak secondary bonding typical of polymer interlaces. The polarization itself consists of dipole orientation characterized by relatively high activation energy.The intrinsic mechanical properties for this material had been determined by the manufacturer, but the performance parameters reported in this study have been determined for the first time for exploration of further uses for this material.The author wishes to acknowledge the assistance provided by Ralph Pitman in the preparation of the samples for this work. |
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Keywords: | generation of charge carriers metton liquid-molding resin static charging stress relaxation and creep thermal conductivity and specific heat |
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