MEMS封装中的封帽工艺技术

MEMS封装技术大多是从集成电路封装技术继承和发展而来,但MEMS器件自身有其特殊性,对封装技术也提出了更高的要求,如低湿,高真空,高气密性等。本文介绍了五种用于MEMS封装的封帽工艺技术,即平行缝焊、钎焊、激光焊接、超声焊接和胶粘封帽。总结了不同封帽工艺的特点以及不同MEMS器件对封帽工艺的选择。本文还介绍了几种常用的吸附剂类型,针对吸附剂易于饱和问题,给出了封帽工艺解决方案,探讨了使用吸附剂、润滑剂控制封装内部环境的方法。

Sealing Technologies in the Packaging of Microelectromechanical System

Most MEMS packaging technologies are inherited and developed from IC packaging,but the MEMS devices have themselves specialities and need high requirements to the package,such as low temperature,high vacuum,high hermeticity,etc.5 kinds of sealing processes for MEMS packaging were introduced,including parallel seam welding,soldering,laser welding,ultrasonic welding and lid sealing with adhesive,and the characteristics of different sealing processes and sealing processes selection of different MEMS devices were summarized.Some common types of getters were introduced.Some solutions of sealing processes were given for the getters easy saturating problems,the methods of using getters and lubricants to control the in-package atmosphere were discussed.