DDR3芯片基于XR8238A全地址全功能老炼过程测试

集成电路老炼的主要目的是模拟芯片的工作寿命,加偏压、加高温模拟产品最坏的工作条件,作为可靠性监控和从批次产品中剔除早期失效产品。取决于老炼时间的长短,早衰期或者损耗期的缺陷均可导致芯片的失效。第三代双倍数据率同步动态随机存储器目前还没有一套完整的老炼试验方法。基于设备XR8238A设计一套印制板,区别于传统的老炼试验模式,给芯片写入完整的数据,输出符合预期的波形,有效地完成了老炼过程测试,提供了第三代双倍数据率同步动态随机存储器产品出货平均故障间隔时间试验的一种方法,提升了集成电路老炼的效果。

Research of DDR3 Chip Full-Address and Global Function Burn in Test Based on XR8238A

Burn in is the main purpose of simulating operating life of chips.Forcing biasing voltage and high temperature is to simulate the worst using environment.Burn in is used to monitor the reliability and reject the early failure from the products.It is depended on the time of burn in,the defect of premature senility or the loss of aging may result in the failure of chips.A set of printed board based on XR8238A is designed,the code pattern is written in,and the expected waveform is outputted,which efficiently completes the research of burn in test and fills the blank of MTBF test(mean time between failures).The effect of burn in test is improved greatly.