Electronic properties of electrolyte/anodic alumina junction during porous anodizing |
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Authors: | I. Vrublevsky A. Jagminas Werner A. Goedel |
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Affiliation: | a Department of Microelectronics, Belarusian State University of Informatics and Radioelectronics, 6 Brovka Street, Minsk 220013, Belarus b Institute of Chemistry, A. Goštauto 9, LT-01108 Vilnius, Lithuania c Institut für Chemie, Technische Universität Chemnitz, Chemnitz D-09107, Germany d InnoMat GmbH, Chemnitz, Germany |
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Abstract: | The growth of porous oxide films on aluminum (99.99% purity), formed in 4% phosphoric acid was studied as a function of the anodizing voltage (23-53 V) using a re-anodizing technique and transmission electron microscopy (TEM) study. The chemical dissolution behavior of freshly anodized and annealed at 200 °C porous alumina films was studied. The obtained results indicate that porous alumina has n-type semiconductive behavior during anodizing in 4% phosphoric acid. During anodising, up to 39 V in the barrier layer of porous films, one obtains an accumulation layer (the thickness does not exceed 1 nm) where the excess electrons have been injected into the solid producing a downward bending of the conductive and valence band towards the interface. The charge on the surface of anodic oxide is negative and decreases with growing anodizing voltage. At the anodizing voltage of about 39 V, the charge on the surface of anodic oxide equals to zero. Above 39 V, anodic alumina/electrolyte junction injects protons from the electrolyte. These immobile positive charges in the surface layer of oxide together with an ionic layer of hydroxyl ions concentrated near the interface create a field, which produces an upward bending of the bands. |
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Keywords: | Porous alumina Electronic properties Semiconductive behavior Anodic alumina/electrolyte junction Embedded space charges |
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