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Deposition and growth kinetics studies of thin zirconium dioxide films by UVILS-CVD
Authors:Mingliang Chen  Qi Fang  Zijing Lin  Ian W. Boyd
Affiliation:a Hefei National Laboratory for Physical Sciences at Microscale, University of Science and Technology of China, Hefei, Anhui 230026, PR China
b Electronic and Electrical Engineering, University College London, Torringon Place, London WC1E 7JK, UK
Abstract:We report the deposition of thin zirconium dioxide films on Si(1 0 0) by a technique of ultraviolet-assisted injection liquid source chemical vapor deposition (UVILS-CVD) by using ultraviolet with 222 nm radiation. The alkoxide zirconium(IV) tert-butoxide (Zr[OC(CH3)3]4) was used as precursor while nitrous oxide was driven into the reaction chamber as an oxidizing agent. The ZrO2 films were deposited under various conditions and characterized by ellipsometry, Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, X-ray diffraction and scanning electron microscopy. The growth rate decreased with the increasing of substrate temperatures from 200 to 400 °C. Deposition rate of 20 nm/min was observed at a substrate temperature of 350 °C. There was a liner relation between the thicknesses of the films and deposition times. As a result the thicknesses can be accurately controlled by changing the number of drops of precursor introduced by the injection liquid source. The growth rate increased with the increasing concentrations of the precursor, nevertheless the trend stopped when the concentration exceeded 8.5%. The growth kinetics were also studied and the results were fit to a three-step kinetic model involving a photo chemical reaction, a reversible precursor absorption process and a following irreversible deposition reaction.
Keywords:Metal oxide semiconductor field effect transistor   UVILS-CVD   Microelectronic industry
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