Oxidizing agent concentration effect on metal-assisted electroless etching mechanism in HF-oxidizing agent-H2O solutions

The mechanism of metal-assisted electroless etching of silicon in HF-oxidizing agent-H₂O etching system as a function of oxidizing agent concentration was studied. Three types of oxidizing agent were experimented namely Na₂S₂O₈, K₂Cr₂O₇ and KMnO₄. Their concentrations were varied from 0.05 M to 0.3 M. The layers formed on silicon were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy-dispersive X-ray (EDX). It is shown that an insoluble solid-phase film (K₂SiF₆) form on silicon surface when concentration of K₂Cr₂O₇ or KMnO₄ increases in chemical solutions. On other hand, when Na₂S₂O₈ concentration increases, the surface roughness decreases without any chemical complex formation.