Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects |
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| Authors: | Yeau Ren Jeng Sang Mao Chiu |
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| Institution: | (1) Department of Mechanical Engineering, National Chung Cheng University, 621 Chiayi, Taiwan, People’s Republic of China |
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| Abstract: | This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire
onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric
oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need
for the elaborate procedures and equipment required by more conventional wire bonding methods. |
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| Keywords: | Wire bonding chips with copper interconnects copper oxide |
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