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电感耦合等离子体原子发射光谱法同时测定铜基低银焊料中的银、磷和锡
引用本文:张敏霞,潘光勇,商其英,李景婧.电感耦合等离子体原子发射光谱法同时测定铜基低银焊料中的银、磷和锡[J].分析测试技术与仪器,2018(3):169-172.
作者姓名:张敏霞  潘光勇  商其英  李景婧
作者单位:浙江三花智能控制股份有限公司计量测试中心
摘    要:采用王水消解铜基低银焊料样品,选择Ag 328.0 nm、P 178.2 nm、Sn 189.9 nm作为分析线,建立了电感耦合等离子体原子发射光谱法(ICP-AES)同时测定铜基低银焊料中银、磷和锡元素的分析方法.在选定的试验条件下,方法检出限为0.002 4%~0.004 8%(质量分数),各元素校准曲线线性相关系数均大于0.999 5.按照试验方法测定样品,加标回收率为95%~103%,测定结果的相对标准偏差(RSD,n=10)均小于5%.

关 键 词:电感耦合等离子体原子发射光谱法  铜基低银焊料
收稿时间:2018/8/31 0:00:00
修稿时间:2018/9/17 0:00:00

Simultaneous Determination of Ag, P and Sn in Copper Alloy by Inductively Coupled Plasma Atomic Emission Spectrometry
ZHANG Min-xi,PAN Guang-yong,SHANG Qi-ying and LI Jing-jing.Simultaneous Determination of Ag, P and Sn in Copper Alloy by Inductively Coupled Plasma Atomic Emission Spectrometry[J].Analysis and Testing Technology and Instruments,2018(3):169-172.
Authors:ZHANG Min-xi  PAN Guang-yong  SHANG Qi-ying and LI Jing-jing
Institution:Zhejiang Sanhua Intelligent Controls Co., Ltd., Xinchang 312500, Zhejiang China,Zhejiang Sanhua Intelligent Controls Co., Ltd., Xinchang 312500, Zhejiang China,Zhejiang Sanhua Intelligent Controls Co., Ltd., Xinchang 312500, Zhejiang China and Zhejiang Sanhua Intelligent Controls Co., Ltd., Xinchang 312500, Zhejiang China
Abstract:A method for the simultaneously determined of Ag, P and Sn in copper-based solder of low silver was developed using inductively coupled plasma atomic emission spectrometry(ICP-AES)with Ag 328.0 nm, P 178.2 nm, Sn 189.9 nm as analysis lines.The samples were dissolved in aqua regia solution. Under the selected experimental conditions, the detection limit of the method was 0.002 4%~0.004 8% (mass fraction), all the linear correlation coefficients of calibration curves of each element were greater than 0.999 5. According to the test method, the recovery of standard addition was 95%~103%, and the relative standard deviation (RSD, n=10) of the results was less than 5%.
Keywords:ICP-AES  copper-based solder of low silver
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