埋置电容板板边分层探究和改良

针对埋容板板边分层问题,通过分析并跟进埋容板生产各关键制程,确认了埋容板板边分层的原因。受机械应力作用时铜层与埋容材料层之间出现微小裂纹,随着机械应力作用次数的增加,裂纹扩展导致分层。通过试验验证,更改了埋容层芯板的制作照相底片,彻底解决了埋容板板边分层的问题。

Research for delamination of the capacitors embedded in the PCB

The reasons of the delamination of capacitors embedded in the PCB had been confirmed by following up the production process, making slices of metallic phase and analyzing the elements of metallic phase. The mechanical properties differed in dielectric layer and copper layer. Crack occurred in capacitors embedded PCB when the PCB were subjected to mechanical stresses. The size of the crack increased with the increase of the action numbers of mechanical stress, which led to the delamination of capacitors embedded in the printed circuit board. The film used for making capacitors embedded in the PCB had been changed and the problem of the delamination had been completely solved.