Mutual Influence of Electrode Processes during Electrodeposition of Layered Structures by the Single-Bath Method: The Effect of Nickel Deposition and Hydrogen Evolution on the Transport of Copper Ions in Acetate and Sulfamate Electrolytes

The effect of nickel deposition and hydrogen evolution on the transport of copper-containing ions is studied by numerically solving an electrodiffusion problem with use made of variational values of the formation constants of nickel and copper complexes in acetate and sulfamate electrolytes and thicknesses of the diffusion layer. It is concluded that the major contribution to the mass transfer is made by the effects of exaltation of the migration current and by the agitation of the near-electrode layer of electrolyte by evolving hydrogen. The possibility of employing migration effects in order to reduce the limiting current of copper in the region of nickel deposition and hydrogen evolution is substantiated. This will decrease the copper content in a layer of alloy during electrodeposition of layered structures.