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常压射频冷等离子体TEOS工艺沉积二氧化硅薄膜的光谱研究
引用本文:李立,王守国,赵玲利,叶甜春. 常压射频冷等离子体TEOS工艺沉积二氧化硅薄膜的光谱研究[J]. 光散射学报, 2006, 18(4): 360-364
作者姓名:李立  王守国  赵玲利  叶甜春
作者单位:1. 四川大学物理科学与技术学院,微电子技术四川省重点实验室,成都,610064
2. 中国科学院光电研究院,北京,100010
3. 中国科学院微电子所,北京,100010
摘    要:常压射频冷等离子体是近年来广受关注的一种新兴技术,在薄膜沉积方面已体现出其巨大潜力,但由于等离子体本身反应的复杂性,使其在薄膜沉积方面的机理至今尚未完全清楚。本文旨在从光谱分析的角度,研究常压射频冷等离子体TEOS工艺沉积二氧化硅薄膜。实验中我们检测到了Si和C-H的特征峰,表明二氧化硅是由TEOS在等离子体中分解而形成的。同时还研究了不同输入功率下Si和C-H的特征峰强度的变化情况,并发现其变化规律与生长速率有着很好的相似性。在温度为200℃的条件下所生成的SiO2薄膜的折射率在1.47-1.48的范围内。

关 键 词:常压  射频  冷等离子体  TEOS  二氧化硅  光谱
文章编号:1004-5929(2006)04-0360-05
收稿时间:2005-07-01
修稿时间:2005-07-01

An Optical Emission Spectroscopy Study of the Deposited SiO2 Film with RF Cold Plasma at Atmospheric-pressure
LI Li,WANG Shou-guo,ZHAO Ling-li,YE Tian-chun. An Optical Emission Spectroscopy Study of the Deposited SiO2 Film with RF Cold Plasma at Atmospheric-pressure[J]. Chinese Journal of Light Scattering, 2006, 18(4): 360-364
Authors:LI Li  WANG Shou-guo  ZHAO Ling-li  YE Tian-chun
Affiliation:1. Key Lab of Microelectronics of Sichuan Province, Dept. Microelectronics, Sichuan University, Chengdu , Sichuan 610064, P. R. China ;2. Institute of opto-electronics, Chinese Academy of Science, Beijing , 100010, P. R. China ; 3.Institute of Microelectronics , Chinese Academy of Science, Beijing , 100010, P. R . China
Abstract:The radio frequency(RF)cold plasma at atmospheric-pressure,as a new technique for films deposition,shows enormous potential of large-scale application.For the complexity of the reactions in the plasma,the mechanism of the films deposition is not clear.In this paper,the technique of the SiO_2 deposition used the RF cold plasma at atmospheric-pressure is analysed by the optical emission spectroscopy(OES).The Si and C-H peaks detected by the OES shows that the SiO_2 is the decomposed product of TEOS.Furthermore,the dependence of the Si and C-H emission intensities on RF power are also studied,and they show a good agreement with the dependence of the deposition rate on RF power.The refractive index of the films deposited at 200℃ is ranged from 1.47 to 1.48.
Keywords:atmospheric-pressure  RF  cold plasma  TEOS  SiO_2  OES
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