| LTCC腔体及微流道制作技术 |
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| 引用本文： | 李有成,李海燕,王颖麟.LTCC腔体及微流道制作技术[J].电子工艺技术,2014(1):22-25. |
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| 作者姓名： | 李有成 李海燕 王颖麟 |
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| 作者单位： | 西北电子装备技术研究所,山西太原030024 |
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| 基金项目： | 国家国际科技合作项目（项目编号：2010DFB70110）. |
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| 摘 要： | 简要介绍了LTCC腔体和微流道的用途、结构形式以及腔体的制作方法。详细分析了LTCC空腔在层压和共烧时产生变形的原因。重点阐述了腔体填充材料控制工艺形变的方法,碳基牺牲材料的特性、作用以及控制腔体变形的理论基础。通过工艺试验验证了碳基牺牲材料的有效性。说明采用合理的填充材料、恰当的工艺技术可以制作出满足要求的空腔结构。
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| 关 键 词： | 低温共烧陶瓷 腔体 微流道 |
Cavity and Microfluidics Fabrication Technology on LTCC Substrate |
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| LI You-cheng,LI Hai.yan,WANG Ying-lin.Cavity and Microfluidics Fabrication Technology on LTCC Substrate[J].Electronics Process Technology,2014(1):22-25. |
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| Authors: | LI You-cheng LI Haiyan WANG Ying-lin |
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| Institution: | ( The Northwest Electronic Equipment Institute of Technology, Taiyuan 030024, China ) |
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| Abstract: | Briefly introduce the structure and the application of LTCC cavity and microfluidics, as well as the fabrication method of LTCC cavity. Analyze the reason of LTCC cavity deformation when it is laminated and sintered. Expound the method of controlling cavity deformation with filling material, characteristics and functions of carbon sacrificial material, and theoretical basis of controlling cavity deformation. The efficiency of the carbon sacrificial material was verified by the test. It is found that reasonable filling materials and appropriate technology can fabricate qualified cavity and microfluidics. |
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| Keywords: | LTCC Cavity structures Microfluidics |
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