| Abstract: | Preparation of a polyimide nanofoam (PI‐F) for microelectronic applications was carried out using a polyimide precursor synthesized from poly(amic acid)‐co‐(amic ester)] and grafted with a labile poly(propylene glycol) (PPG) oligomer. Polyimide precursor was synthesized by partial esterification of poly(amic acid) (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA). The precursor was then grafted with bromide‐terminated poly(propylene glycol) in the presence of K2CO3 in hexamethylphosphoramide and N‐methylpyrrolidone, imidized at 200°C in nitrogen and the product was subsequently decomposed in air at 300°C to eliminate the labile PPG oligomer to produce PMDA/ODA polyimide nanofoam. Nuclear magnetic resonance spectroscopy (1H‐NMR) and Fourier transform infrared spectroscopy (FT‐IR) techniques were used to characterize the formation of polyimide precursor and extent of grafting of PPG with polyimide. The results of thermogravimetric analysis (TGA) showed three step decomposition of nanofoam with the removal of PPG at 350°C and decomposition of polyimide at around 600°C. The polyimide nanofoams were also characterized by small angle X‐ray scattering (SAXS), field‐emission scanning electron microscopy (FE‐SEM) and transmission electron microscopy (TEM). The morphology showed nanophase‐separated structures with uniformly distributed and non‐interconnected pores of 20–40 nm in size. Dynamic mechanical analysis (DMA) indicated higher storage modulus for the foamed structure compared to the pure PI with reduction in loss tangent for the former system. Copyright © 2004 John Wiley & Sons, Ltd. |
