用于大功率半导体激光器的新型焊料

在大功率半导体激光器列阵及叠阵的组装中,焊料的选择是极其关键的,因为焊料直接参与对激光器的导电、导热激光器所需的电流全部从焊料通过,而半导体激光器列阵或叠阵工作时电流是很大的,可达50A～100A。同时半导体激光器工作时产生的热量非常大,如焊料的导热性不好,由于电流的热效应,就会在焊料上产生巨大的热量,使焊料熔化。文中研制了一种新型的焊料,这种焊料在两层铟之间蒸镀几层金,焊料由钨/镍/金/铟/铜等多层金属构成。利用这种焊料研制出脉冲功率达100W的半导体激光器列阵。

A New Type of Solder for High-Power Semiconductor Laser Arrays and Stacks

Selection of solders is of utmost importance in high-power semiconductor laser arrays and stacks assembly, because the solders participate directly in electricity conduction and heat conduction for the lasers. The currents required by the lasers all flow through the solders, while the working currents of semiconductor laser arrays and stacks can be quite high, say 50A to 100A, Meanwhile, semiconductor lasers produce large quantities of heat while working. Huge amounts of heat will produce in the solders due to the heat effect of electric currents, and the heat can possibly melt the solders owing to bad heat conductivity of the solders. A new type of solder with several layers of Au between the two layers of In was made, which constitutes of multilayers of W/Ni/Au/In/Cu. A semiconductor laser array with pulse power of 100W was made by utilizing the solder.