聚乙二醇聚合度对其吸附和阻化Cu2+放电的影响

研究了聚乙二醇的聚合度对其在汞电极上的吸附和阻化铜离子放电的影响。结果表明,随聚合度增大,吸附电位区扩大,对铜离子放电的阻化能力增强,但聚合度大于100则影响不大,作为酸性镀铜添加剂的最佳聚合度约为120。并提出聚乙二醇分子的吸附模型及其阻化铜离子放电的机理,能满意地解释聚合度对其在电极上的吸附和阻化铜离子放电的影响规律。

Effects of Polymerization Degree of Polyglycols on Their Adsorption and Inhibition of Cu2+ Discharge

Effects of polymerization degree of polyglycols on their adsorption on Hg and inhibition of Cu²⁺ discharge were studied. It follows that increasing polymerization degree with widen the potential region of adsorption and enhance the inhibiting effect upon Cu²⁺ discharge, but a little further effect is made when the polymerization degree is more than 100; as a result, the polyglycol with polymerization degree about 120 is suggested to be used as the additive in acidic copper-plating. In this paper the models for the adsorption of polyglycol molecules and the mechanism of inhibition of Cu²⁺ discharge are discussed,by which the regularity on the effects of the polymerization degree can be satisfactorily explained.