| Abstract: | Advances in the fabrication technologies associated with electronic devices have placed increasing demands on microlithography, the technology used to generate today's integrated circuits. Within the next few years, a new form of lithography will be required that routinely produces features of less than 0.1 μm. As the exposing wavelength of light decreases to facilitate higher resolution imaging, the opacity of traditional materials precludes their use; and major research efforts to develop alternate materials are underway. As a current example, lithography tools utilizing 193 nm light are now being introduced into the manufacturing environment. Through understanding of materials structure and its relationship to device process requirements and performance, a new class of cyclo‐olefin based polymers was designed for these applications. In particular, alicyclic monomers such as norbornene are readily copolymerized with maleic anhydride and substituted acrylates to afford a wide range of alternative matrices that exhibit transparency at the exposing wavelength and aqueous base solubility. Materials properties must be carefully tailored to maximize lithographic performance with minimal sacrifice of other performance attributes. Further reduction in exposing wavelength to 157 nm introduces new challenges in polymer materials design. Efforts to address those challenges will be discussed. |
