A combined XPS/AES study of Cu segregation to the high and low index surfaces of a Cu-Ni alloy

Quantitative information was obtained regarding the equilibrium segregation of Cu to the high index surfaces (cut 5° off the (100) plane in the [001] and [011] directions) and low index surfaces ((100), (111) and (110)) of a Cu: Ni, 5: 95% alloy crystal. Data regarding segregation to the (111) surface of a Cu: Ni, 50: 50% alloy crystal was also obtained. Equilibrium surfaces were obtained by careful annealing in the temperature range 850–920 K to avoid Cu loss by evaporation. The surface composition profile was calculated using data from the combination of the X-ray Photo-electron Spectroscopy and Auger Electron Spectroscopy techniques. Using these techniques, a wide range of electron kinetic energies and associated electron escape depths can be probed, yielding information about the topmost layer concentration and about the concentration profile into the bulk. Extensive Cu segregation was observed for the 5% and 50% Cu alloys. Topmost layer compositions of 85–100% Cu were found for both the high and low index surfaces of the 5% Cu alloy. In the next two or three atomic layers the composition was found to drop swiftly to near bulk Cu levels. For atomic layers deeper than this, some experimental evidence suggested a rise in Cu composition over three or four layers to 8–17% Cu before bulk levels were finally regained. For the 50% Cu alloy sample, a topmost layer composition was found of 95–100% Cu. Bulk levels of Cu were regained in about four atomic layers. These results are discussed in relation to other theoretical and experimental studies of segregation in these Cu-Ni alloys. The significance of the measured composition in relation to an equilibrium surface is also considered.