| IEC TR62380可靠性预计通用模型分析 |
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| 引用本文： | 段翠霞,林长苓,聂国健.IEC TR62380可靠性预计通用模型分析[J].电子产品可靠性与环境试验,2011,29(5):21-25. |
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| 作者姓名： | 段翠霞 林长苓 聂国健 |
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| 作者单位： | 工业和信息化部电子第五研究所,广东 广州,510610 |
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| 摘 要： | 分析了国外典型电子元器件数据手册——IEC TR 62380《电子组件,PCBs和设备的可靠性预计通用模型》,并简要介绍了该预计手册中电子元器件的可靠性预计模型和方法.分析结果表明,模型直接考虑了环境的影响,并以设备任务剖面的热循环代替了难以评价的环境因子;在部件失效率中包含了与部件焊接相关的故障.
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| 关 键 词： | 元器件 可靠性预计 模型 方法 |
Reliability Prediction Methods of IEC TR 62380 |
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| DUAN Cui-xia,LIN Chang-ling,NIE Guo-jian.Reliability Prediction Methods of IEC TR 62380[J].Electronic Product Reliability and Environmental Testing,2011,29(5):21-25. |
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| Authors: | DUAN Cui-xia LIN Chang-ling NIE Guo-jian |
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| Institution: | (CEPREI,Guangzhou 510610,China) |
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| Abstract: | The typical electronic component data handbook——IEC TR 62380"Universal model for reliability prediction of electronics components,PCBs and equipment"——is analyzed,and the models and methods for reliability prediction of electronic components in the handbook is briefly introduced.It is shown that the models take directly into account the influence of the environment.The environmental factor that is difficult to evaluate is replaced with the thermal cycling in the mission profiles of the equipment.On the other hand,the failure rate related to the component soldering is included in the component failure rate. |
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| Keywords: | component reliability prediction model method |
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