| 微组装电路的设计特点与制造技术 |
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| 引用本文： | 邓荣祥.微组装电路的设计特点与制造技术[J].微电子学,1995,25(6):1-6. |
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| 作者姓名： | 邓荣祥 |
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| 作者单位： | 电子工业部第２４研究所 |
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| 摘 要： | 分析了国内微组装电路的发展现状，深入探讨了微 组装电路的设计特点和结构工艺制造技术，提出了发展微组装电路物途径。
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| 关 键 词： | 微组装 模块 IC |
An Examination of the Design and Manufacturing Technologies for Microassembly Modules |
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| Deng Rongxiang.An Examination of the Design and Manufacturing Technologies for Microassembly Modules[J].Microelectronics,1995,25(6):1-6. |
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| Authors: | Deng Rongxiang |
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| Abstract: | Recent development of microassembly modules in China is reviewed.The design char-acteristics and difficulties are examined.The structural process and fabrication processes are dis-cussed.Approaches to developing microassembly modules are proposed. |
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| Keywords: | Microassembly Module IC SMT MCM |
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