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改进钎焊技术的有效途径
引用本文:徐婷婷.改进钎焊技术的有效途径[J].电子元件与材料,1996,15(2):30-32.
作者姓名:徐婷婷
作者单位:西门子数字程控系统有限公司
摘    要:改进钎焊技术需从钎焊工艺和焊料选择两方面入手。选用Sn/Pb比为63/37,且在惰性气体保护下铸造或轧制的焊料并采用抗氧化磷片调整焊锡的流动性是改进钎焊技术的有效途径。

关 键 词:钎焊技术  焊料选择  抗氧化磷片

A Practical Approach to the Improvement of Solder Technology
Xu Tingting.A Practical Approach to the Improvement of Solder Technology[J].Electronic Components & Materials,1996,15(2):30-32.
Authors:Xu Tingting
Institution:Xu Tingting
Abstract:Improvement of solder processes and correct choice of soldet are the necessary methods for the improvement of solder technology.A practical approach is to preparing,solder by casting or rolling the material of Sn/Pb(63/37) under the atmosphere of inert gas with additive of antioxygenic phosphorus for better fluidity.
Keywords:solder technology  choice of solder  antioxygenic phosphorous  
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