| 先进芯片封装技术 |
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| 引用本文： | 鲜飞.先进芯片封装技术[J].电子与封装,2004,4(4):13-16,4. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 微电子技术的飞速发展推动了新型芯片封装技术的研究和开发。本文主要介绍了几种新型芯片封装技术的特点,并对未来的发展趋势及方向进行了初步分析。
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| 关 键 词： | 芯片 封装 BGA CSP COB Flip Chip MCM |
The Advanced Chip Package Technology |
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| Xian Fei Fiberhome Telecommunication Technologies Co.,Ltd,Wuhan.The Advanced Chip Package Technology[J].Electronics & Packaging,2004,4(4):13-16,4. |
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| Authors: | Xian Fei Fiberhome Telecommunication Technologies Co Ltd Wuhan |
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| Institution: | Xian Fei Fiberhome Telecommunication Technologies Co.,Ltd,Wuhan 430074 |
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| Abstract: | The rapid development of microelectronic technology has been giving impetus to the developmentof new chip package technology. Characteristics of several advanced chip package technology are introduced inthe paper. The up-to-date trends are discussed and the future research directions are suggested. |
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| Keywords: | Chip Package BGA CSP COB Flip Chip MCM |
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