| 应用湿镀工艺形成微细线路的新发展 |
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| 引用本文： | 蔡积庆.应用湿镀工艺形成微细线路的新发展[J].印制电路信息,2005(12):34-37. |
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| 作者姓名： | 蔡积庆 |
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| 摘 要： | 概述了在微细线路形成中湿式镀工艺的新开发,可以在改性聚酰亚胺膜上形成微细线路图形。
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| 关 键 词： | 湿式镀工艺 改性聚酰亚胺 纳米粒子 微细线路图形 |
New Development of Micro Fine Circuit Formation Using Wet Plating Process |
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| Cai Jiqing.New Development of Micro Fine Circuit Formation Using Wet Plating Process[J].Printed Circuit Information,2005(12):34-37. |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper describes new development of wet plating process in micro fine circuit formation.It can form micro fine circuit pattern on improved performance polyimide film. |
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| Keywords: | wet plating process improved performance polyimide nanon particle micro fine circuit pattern |
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