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Electrohydrodynamic micropatterning of silver ink using near-field electrohydrodynamic jet printing with tilted-outlet nozzle |
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| Authors: | Doo-Hyeb Youn Seong-Hyun Kim Yong-Suk Yang Sang-Chul Lim Seong-Jin Kim Su-Han Ahn Hyo-Sun Sim Seung-Myoung Ryu Dong-Wook Shin and Ji-Beom Yoo |
| Institution: | (1) IT Components and Materials Technology Research Division, Electronics and Telecommunications Research Institute, Daejeon, 305-350, South Korea;(2) Mitsubishi Cable Industries Ltd. 8, Nishino-cho, Amagasaki Hyogo, 660-0856, Japan;(3) DMK Co., Ltd. 17B-1L, 4 Gong-dan, Mosi-, jiksan-eup, Cheonan-si, Chungchengnam-do, 305-350, South Korea;(4) School of Information and Communication Engineering and Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, 440-746, South Korea |
| Abstract: | This paper introduces for the first time near-field electrohydrodynamic jet printing with tilted-outlet nozzle to obtain the fine and highly conductive patterns of silver (Ag) ink. Line widths produced by near-field electrohydrodynamic jet printing are less than 6 μm, which is approximately twenty times smaller than that of inkjet printing. Under optimized Ag ink annealing ranges 3–9 min for 30 wt% at 150°C, we observed Ag line pattern resistivities as low as 7×10−6 Ω⋅cm. Ag ink conduction mechanisms were brought to light from microstructure analysis and post-thermal-annealing examination of electrical characteristics. |
| Keywords: | PACS" target="_blank">PACS 47 65 -d 47 54 -r 66 20 +d 61 46 +w 83 80 Gv |
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