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Copper Incorporation in ZnO during LP-MOCVD
Authors:Th. Kaufmann  M. Webert  G. Fuchs  H. Arnol
Abstract:The MOCVD of ZnO layers, at a reduced reactor pressure and using DMZ.2THF and tertiary butanol as zinc and oxygen sources, resp., presents a number of advantages compared with the deposition at normal pressure. This also applies to the copper incorporation by means of cyclopentadienyl-copper(I)-triethyl phosphine. For the copper concentration in the ZnO layers, which linearly increases with the flow rate of the organocopper compound, values > 1020 cm−3 can be achieved. Even in case of high concentrations, the desired compensating effect of the copper is, for the time being, comparatively little, but increases considerably after a thermal retreatment of the layers. Some chemical-defect aspects of ZnO will be discussed for the purpose of interpretation.
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