Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Surface modification of polyimide (PI) films were first carried out by chloromethylation under mild conditions, followed by surface-initiated atom-transfer radical polymerization (ATRP) of 4-vinylpyridine (4VP) from the chloromethylated PI surfaces. The composition and topography of the PI surfaces modified by poly(4-vinylpyridine) (P4VP) were characterized by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), respectively. The P4VP brushes with well-preserved pyridine groups on the PI surface was used not only as the chemisorption sites for the palladium complexes without prior sensitization by SnCl₂ solution during the electroless plating of copper, but also as an adhesion promotion layer to enhance the adhesion of the electrolessly deposited copper to the PI surfaces. The T-peel adhesion strength of the electrolessly deposited copper on the modified PI surface could reach about 6.6 N/cm. Effects of the polymerization time and the activation time in the PdCl₂ solution on the T-peel adhesion strength of the electrolessly deposited copper in the Sn-free process to the modified PI surface were also studied.