| Abstract: | An investigation of the defect structure of silicon homoepitaxial layers, as influenced by gas phase etching, deposition temperature, and substrate properties, is presented. The minimum values of etch removal and deposition temperature necessary for sufficient layer perfection have been determined. The defect and impurity distribution in the substrate, as formed during a preceeding arsenic buried layer processing, have been evaluated and are discussed here with regard to their influence on the epitaxial layer perfection. |
