On the mechanism of chemical polishing of GaAs crystals

In order to establish reproducible conditions for chemical lap polishing of GaAs with NaOCl solutions, containing also OH⁻- and CO -ions, the mechanism of dissolution was investigated using the rotating disk arrangement. In solutions with excess OCl⁻ concentrations likewise diffusion and a reaction of the first order with respect to OH⁻ and CO, complexing agents for Ga-ions, control the dissolution rate, and the surfaces of the wafers are polished. OH⁻ and CO₃^2– concentrations in excess with respect to OCl⁻ lead to rate determining OCl⁻ diffusion and to irregularly polished or film covered surfaces. Diffusion constants for OH⁻, CO and OCl⁻ are given.