Paramagnetic defects in silicon/silicon dioxide systems

Paramagnetic defect centers in Si/SiO₂ systems have been observed by direct ESR, optically-induced ESR, and NMR relaxation of liquids at the outer oxide surface. In general, all the defects reported elsewhere were confirmed, but with some significant discrepancies in character. The P_B center was observable even at room temperature. The P_C center was found to exist much deeper in the silicon than previously determined, and it is tentatively identified to be neutral iron. Surface liquid relaxation is very strong on oxidized crushed silicon, is not dependent on liquid composition, and suggests a strong wide-line spin center in the outer oxide surface. The optically activated spin center created by HF/HNO₃ etches was found not to involve H₂O or OH functionalities, and appears to be a nitrogenous radical. The optical defect center lies within the silicon, and its presence warrants caution in use of HNO₃-based etches in wafer processing. Oxides prepared at elevated pressures show fewer P_A and P_C defects than those produced by conventional processing, which indicates potential merit in pressure oxidation methods.