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Optical properties,luminescence quenching mechanism and radiation hardness of Eu-doped GaN red powder phosphor
Authors:W. Jadwisienczak  K. Wisniewski  M. Spencer  T. Thomas  D. Ingram
Affiliation:1. School of Electrical Engineering & Computer Science, Ohio University, Athens, OH 45701, USA;2. Institute of Experimental Physics, Gdańsk University, ul. Wita Stwosza 57, Gdańsk 80-952, Poland;3. School of Electrical and Computer Engineering, Cornell University, Ithaca, NY 14853, USA;4. John E. Edwards Accelerator Laboratory, Department of Physics and Astronomy, Ohio University, Athens, OH 45701, USA
Abstract:We report on the luminescence quenching mechanism of Eu-doped GaN powder phosphor produced with a low-cost, high yield rapid-ammonothermal method. We have studied as-synthesized and acid rinsed Eu-doped GaN powders with the Eu concentration of ~0.5 at.%. The Eu-doped GaN photoluminescence (PL) was investigated with 325 nm excitation wavelength at hydrostatic pressures up to 7.7 GPa in temperature range between 12 K and 300 K. The room temperature integrated Eu3+ ion PL intensity from acid rinsed material is a few times stronger than from the as-synthesized material. The temperature dependent PL studies revealed that the thermal quenching of the dominant Eu3+ ion transition (5D0  7F2) at 622 nm is stronger in the chemically modified phosphor indicating more efficient coupling between the Eu3+ ion and passivated GaN powder grains. Furthermore, it was found that thermal quenching of Eu3+ ion emission intensity can be completely suppressed in studied materials by applied pressure. This is due to stronger localization of bound exciton on Eu3+ ion trap induced by hydrostatic pressure. Furthermore, the effect of 2 MeV oxygen irradiation on the PL properties has been investigated for highly efficient Eu-doped GaN phosphor embedded in KBr–GaN:Eu3+ composite. Fairly good radiation damage resistance was obtained for 1.7 × 1012 to 5 × 1013 cm?2 oxygen fluence. Preliminary data indicate that Eu-doped GaN powder phosphor can be considered for devices in a radiation environment.
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