基于BGA互联的毫米波模块三维集成设计

设计了一种利用微波基板作为转接板的毫米波系统级封装（System in Package，SIP）模块。采用球栅阵列(Ball Grid Array，BGA)作为射频信号层间垂直互联传输和隔离结构，实现了三维集成毫米波模块的低损耗垂直传输。对样件测试结果显示，在28~31 GHz频率范围之间，其端口驻波小于1.5，增益大于30 dB。该三维集成结构简单，射频传输性能良好，其体积仅为传统二维平面封装结构的20%，实现了模块的小型化，可广泛用于微波和毫米波电路与系统。

3D integration design of millimeter wave module based on BGA interconnection

A three-dimensional(3D) integrated millimeter-wave system in package(SIP) using a microwave substrate as a interposer is presented.A ball grid array(BGA) as a vertical interconnects and isolation structure in this module is designed to achieve low loss transmission.The measured results show that voltage standing wave ratio(VSWR) is less than 1.5 and the gain is greater than 30 dB between 28 GHz and 31 GHz.The module demonstrates good transmission performance and its size is only 20% of that of the traditional planar package structures.It can be widely used in microwave and millimeter wave circuits and systems.