Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure |
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Authors: | Qiu-Lian Zeng Zhong-Guang Wang Ai-Ping Xian J K Shang |
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Institution: | (1) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 110016 Shenyang, China;(2) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 61801 Urbana, IL |
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Abstract: | Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition.
The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles
increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located
along the grain boundaries in the areas with finer grains. The areal density of the microcracks increased with both strain
amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior
was shown to result from accumulation of microcrack density with fatigue cycles. |
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Keywords: | Lead-free solder low-cycle fatigue cyclic softening Sn-3 8Ag-0 7Cu alloy |
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