工艺参数扰动下互连线时延的随机点匹配评估算法

提出了一种基于工艺参数扰动的随机点匹配时延评估算法.该算法通过Cholesky分解将具有强相关性的工艺随机扰动转化为独立随机变量，并结合随机点匹配方法和多项式混沌理论对耦合随机互连线模型进行时延分析.最后，利用数值计算方法给出互连时延的有限维表达式.仿真实验结果表明，该算法与HSPICE仿真时延的相对误差不超过2%，且相比于HSPICE显著降低了电路模拟时间.关键词：工艺参数扰动随机互连模型随机点匹配方法多项式混沌理论

Stochastic collocation method for interconnect delay estimation in the presence of process variations

We present a process variations based stochastic collocation method to estimate interconnect delay. This method translates the strongly correlated process variations into orthogonal random variables by Cholesky decomposition. Polynomial chaos expression （PCE） and stochastic collocation method （SCM） are used to analyse the system response. A finite representation of interconnect delay is then obtained by using the collocation approach of minimizing the Hilbert space norm of the residual error. Experiment demonstrates that results obtained from the analysis method agree well with that from HSPICE simulation. The difference between the delays obtained from the analytical method and that from HSPICE is about 0.2% or less. Moreover, the method shows good computational efficiency, and much less running time has been observed compared with HSPICE simulation.