| Abstract: | A platium film was formed on a Ti(Pt-Ti) and on a TiO2(Pt-TiO2-Ti) substrate by the conventional electroplating method (ELP) and by the electroless plating technique (ELSP). The effective minimum film thickness was found to be 0.5 μm judging from the maximum electrocatalytic capablity in alkaline (1 M NaOH) water electrolysis. The film obtained from ELP is superior to that obtained from ELSP, being more tightly bound to the substrate, showing better coverage of the subsrate surface, and also being mechanically stronger. Comparisons with bright Pt and with Pt-black electrodes were made and it is concluded that the electrodes newly prepared using ELP will work as well as Pt-black electrods. The electrodes from ELSP are useful only as cathodes, and are not suitable as anodes. |
