METAL ADHESIVE PROPERTIES OF POLYAMIDES HAVING 4,5-DI(1,4-PHENYLENE)-IMIDAZOLEDIYL STRUCTURE

Polyamides were synthesized by the direct polycondensation of aromatic diamines containing 4,5-imidazolediyl structure with aliphatic dicarboxylic acids, and the metal adhesive properties of these polymaides were studied. The inherent viscosity of the obtained polyamides was in the range of 0.28 to 0.71 dl g^?1. The decomposition temperatures (T _ds) of the obtained polyamides were above 400°C and their glass transition temperatures (T _gs) were from 168 to 198°C. These polyamides also showed good solubilities in polar solvents, such as N-methyl-2-pyrrolidone (NMP), N,N-dimethylacetamide (DMAc) and formic acid. A standard tensile test was performed in order to examine the adhesive property of these polyamides for stainless steel, and the obtained polyamides showed excellent tensile strengths, e.g. polyamide P1s derived from 4,5-di(4-aminophenyl)imidazole (DAPI) and sebasic acid had values of 212 kgf cm^?2 at 20°C, 183 kgf cm^?2 at 120°C, and 133 kgf cm^?2 at 180°C. A commercially available epoxy resin was also examined, and showed great tensile strength at 20°C. However, the strength of the epoxy resin was found to decrease with increasing temperature, whereas polyamide having 4,5-imidazolediyl structure retains its strength at temperatures of up to 180°C. In addition, the polyamide was also derived from 4,4″-diamino-o-terphenyl(DAOT) (rather than DAPI) and sebasic acid, and the properties of the polyamides derived, respectively from DAPI and DAOT were compared.