The effect of component concentrations in electroless nickel plating solution on topography and microrelief of Ni-P coatings

Topography and microrelief of Ni-P coatings deposited by electroless plating from solutions with different composition are examined as a function of concentrations of nickel and acetate ions, solution pH, and stabilizing additives, namely, PbCl₂ and thiourea. The coating growth involves the formation of surface spheroids of which a large percentage are strongly extended in the substrate plane and grow by the layered-growth mechanism. In terms of this mechanism, the changes in the topography and microrelief of coatings and also in the spheroid size as a function of the composition of electroless nickel plating solutions are explained. In solutions studied, the rates of formation of new two-dimensional layers and their propagation in the substrate plane are assessed. As the concentration of hydrated nickel ions in solution decreases, spheroids less extended in the substrate plane are formed and grow probably by the normal growth mechanism. The size distribution of spheroids is obtained and the reasons for the partial formation of spheroids with sizes deviating from those predicted by the normal law are analyzed.