| 无铅化PCB表面材料及工艺特点 |
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| 引用本文： | 史建卫.无铅化PCB表面材料及工艺特点[J].电子工艺技术,2011,32(5):306-313. |
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| 作者姓名： | 史建卫 |
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| 作者单位： | 日东电子科技（深圳）有限公司,广东深圳,518103 |
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| 摘 要： | 无铅化电子组装中PCB表面镀层技术主要有无铅钎料热风整平、浸锡、浸银、化学镀镍/浸金和有机可焊保护层五种。每种工艺技术具有各自的优缺点,每种工艺材料与不同无铅钎料具有不同的兼容性。从可制造性、可生产性以及与无铅钎料的匹配性等方面对五种PCB表面镀层技术做了较为全面的阐述,并通过对润湿性和可靠性评估得到一定的最佳配比,为...
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| 关 键 词： | 表面镀层材料 热风整平 化学镀镍/浸金 有机可焊保护层 润湿性 |
Material and Technology Characters of Lead-free PCB Finish |
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| SHI Jian-wei Company Ltd,Shenzhen,China.Material and Technology Characters of Lead-free PCB Finish[J].Electronics Process Technology,2011,32(5):306-313. |
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| Authors: | SHI Jian-wei Company Ltd Shenzhen China |
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| Institution: | SHI Jian-wei(Sun East Electronic Technology(Shenzhen) Company Ltd,Shenzhen518103,China) |
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| Abstract: | HASL,I-Sn,I-Ag,ENIG and OSP are main PCB finish materials and coating technology in lead-free electronic assembly,which have advantages and disadvantages either,and have different compatibility with lead-free solder as well.Illustrate the five kind of coating process in detail form manufacturability,producibility and combinability with lead-free solder,and get a series of optimum combination by estimating wettability and reliability,which provide a guidance for production. |
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| Keywords: | Finish Material Hot Air Solder Leveling(HASL) Electronicless Ni/Immerse Au(ENIG) Organic Solderability Protection(OSP) Wettability |
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