| Zn-Ni合金共沉积电化学行为与机理研究 |
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| 引用本文： | 吴继勋,刘永勤,孟惠民. Zn-Ni合金共沉积电化学行为与机理研究[J]. 电化学, 1997, 3(3): 314-318 |
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| 作者姓名： | 吴继勋 刘永勤 孟惠民 |
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| 作者单位： | 北京科技大学表面科学与腐蚀工程系 |
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| 基金项目： | 冶金部腐蚀与磨损开放实验室资助 |
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| 摘 要： | 采用直流电镀方法，研究了氯化铵体系的Ｚｎ－Ｎｉ合金共沉积过程的电化学行为以及相随的析氢规律．在外加２Ａ／ｄｍ２阴极电流下，测定电极的交流阻抗谱，提出Ｚｎ－Ｎｉ共沉积过程等效电路模型
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| 关 键 词： | 锌－镍合金 电沉积 |
| 收稿时间： | 1997-08-28 |
The Electrochemical Behavior and Deposited Mechanism of Zn Ni Alloy Codeposition |
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| Wu Jixun Liu Yongqin Meng Huimin. The Electrochemical Behavior and Deposited Mechanism of Zn Ni Alloy Codeposition[J]. Electrochemistry, 1997, 3(3): 314-318 |
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| Authors: | Wu Jixun Liu Yongqin Meng Huimin |
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| Affiliation: | Wu Jixun * Liu Yongqin Meng Huimin |
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| Abstract: | The electrochemical behavior of Zn Ni alloy codeposition and concomitant hydrogen evolution have been studied in the chloride ammonia solution through the d c electroplating method. Under the condition of the applied cathodic current density of 2A/dm 2 , the AC impedance spectra have been measured. An equivalent circuit has been presented for the impedance study on the alloy codeposition. |
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| Keywords: | Zn Ni alloy Electrodeposition |
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