Intense pulsed light sintering of copper nanoink for printed electronics |
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| Authors: | Hak-Sung Kim Sanjay R Dhage Dong-Eun Shim and H Thomas Hahn |
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| Institution: | (1) Mechanical and Aerospace Engineering Department, University of California, Los Angeles, CA 90095, USA;(2) Department of Mechanical Engineering, Hanyang University, Seoul, Republic of Korea;(3) Korea Institute of Science and Technology, Seoul, South Korea;(4) Samsung Electro-Mechanics, Suwon city, Gyunggi-do, South Korea; |
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| Abstract: | An intense pulsed light (IPL) from a xenon flash lamp was used to sinter copper nanoink printed on low-temperature polymer
substrates at room temperature in ambient condition. The IPL can sinter the copper nanoink without damaging the polymer substrates
in extremely short time (2 ms). The microstructure of the sintered copper film was investigated using X-ray powder diffraction
(XRD), optical microscopy, scanning electron microscopy (SEM), X-ray micro tomography, and atomic force microscopy (AFM).
The sintered copper film has a grainy structure with neck-like junctions. The resulting resistivity was 5 μΩ cm of electrical
resistivity which is only 3 times as high as that of bulk copper. The IPL sintering technique allows copper nanoparticles
to be used in inkjet printing on low-temperature substrates such as polymers in ambient conditions. |
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