Stripping voltammetry of copper and lead using gold electrodes modified with self-assembled monolayers

One problem associated with using bare solid metal electrodes, such as gold and platinum, in stripping analysis to determine heavy metal ions such as lead and copper ions in dilute solutions is that underpotential deposition (UPD) gives multiple stripping peaks in the analysis of mixtures. These peaks are often overlapped and cannot be conveniently used for analytical purposes. Bifunctional alkylthiols, such as 3-mercaptopropionic acid, with an ionizable group on the other terminal end of the thiol can form self-assembled monolayers (SAMs) on the surface of the gold electrode. It is shown that such an SAM-modified gold electrode minimizes the UPD effects for the stripping analysis of lead and copper. The anodic peak potential shifts and the peak shape changes, indicating that the SAM changes the deposition and stripping steps of these heavy metal ions. Thus, the sensitivity levels for both single species and mixtures can be significantly improved for the conventional solid electrodes. The mechanism of the deposition reaction at the SAM-modified gold electrodes is discussed. Received: 29 May 1997 / Accepted: 24 June 1997