| 适用于多层片式电子元件生产的半自动高精度切割机 |
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| 引用本文： | 林伟强. 适用于多层片式电子元件生产的半自动高精度切割机[J]. 电子元件与材料, 2003, 22(2): 34-35 |
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| 作者姓名： | 林伟强 |
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| 作者单位： | 广东风华高科肇庆新宝华电子设备有限公司,广东,肇庆,526060 |
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| 摘 要： | 多层片式电子元件大批量生产过程中的切割工序对切割设备的要求主要有切割精度高,稳定性好,生产效率高。本文介绍一种根据上述要求,设计的半自动高精度切割机的工艺流程、系统结构和特点。
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| 关 键 词： | 切割机 高精度 高效率 稳定性 |
| 文章编号： | 1001-2028(2003)03-0034-02 |
The High Accuracy Semiautomatic Cutting Machine for Multi-layer Chip Electronic Components |
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| LIN Wei-qiang. The High Accuracy Semiautomatic Cutting Machine for Multi-layer Chip Electronic Components[J]. Electronic Components & Materials, 2003, 22(2): 34-35 |
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| Authors: | LIN Wei-qiang |
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| Abstract: | Cutting process is very important for making multi-layer chip electronic components. The cutting machine shall meet the following requirements: high cutting accuracy, stability and efficiency. Discussed are the cutting machine so designed as to meet the above-mentioned requirements, including the system structure, the features and the technical process. |
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| Keywords: | cutting machine high accuracy high efficiency stability |
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