| 无铅喷锡上锡不良问题探究与改善 |
| |
| 引用本文： | 赵志平,周刚.无铅喷锡上锡不良问题探究与改善[J].印制电路信息,2012(6):60-63. |
| |
| 作者姓名： | 赵志平 周刚 |
| |
| 作者单位： | 惠州中京电子科技股份有限公司,广东惠州,516008 |
| |
| 摘 要： | 通过客观的分析上锡不良产生机理,对其实施一系列的实验跟踪,最终彻底的解决无铅喷锡所存在的上锡不良等品质问题,达到了最优的企业目标。
|
| 关 键 词： | 无铅喷锡 上锡不良 |
HASL tin defect exploration and improvement |
| |
| ZHAO Zhi-ping,ZHOU Gang.HASL tin defect exploration and improvement[J].Printed Circuit Information,2012(6):60-63. |
| |
| Authors: | ZHAO Zhi-ping ZHOU Gang |
| |
| Institution: | ZHAO Zhi-ping ZHOU Gang |
| |
| Abstract: | Based on an objective analysis on the tin adverse mechanism and implementation of a series of experiments with tracing evidence,this article provides complete solution HASL exist on the poor tin wettability defect,in order to achieve optimal business goals. |
| |
| Keywords: | HASL tin wettability defect |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
