| 硼酸钠/甲阶酚醛树脂配合物的热固化过程和耐热性 |
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| 引用本文： | 谭晓明,黄乃瑜,谢洪泉. 硼酸钠/甲阶酚醛树脂配合物的热固化过程和耐热性[J]. 应用化学, 2002, 19(1): 76-0 |
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| 作者姓名： | 谭晓明 黄乃瑜 谢洪泉 |
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| 作者单位： | 华中科技大学 |
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| 摘 要： | 硼酸钠/甲阶酚醛树脂配合物的热固化过程和耐热性
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| 关 键 词： | 硼酸钠/甲阶酚醛树脂配合物的热固化过程和耐热性 |
| 文章编号： | 1000-0518(2002)01-0076-04 |
| 收稿时间： | 2009-06-29 |
| 修稿时间： | 2001-03-19 |
Thermocuring and Heat Resistance of the Complexes of Sodium Borate with Phenol-Formaldehyde Resin |
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| TAN Xiao-Ming a,HUANG Nai-Yu a,XIE Hong-Quan b. Thermocuring and Heat Resistance of the Complexes of Sodium Borate with Phenol-Formaldehyde Resin[J]. Chinese Journal of Applied Chemistry, 2002, 19(1): 76-0 |
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| Authors: | TAN Xiao-Ming a HUANG Nai-Yu a XIE Hong-Quan b |
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| Affiliation: | TAN Xiao-Ming *a,HUANG Nai-Yu a,XIE Hong-Quan b |
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| Abstract: | Thermocuring and heat resistance of the complexes of sodium borate with phenol-formaldehyde resol resin were studied by thermal analysis and infrared spectroscopy. The results showed that the curing process is an exothermal reaction. On heating, condensation reaction of the hydroxymethyl groups in the complexes takes place and forms methylenes or carbonyl groups. With increase of sodium borate in the complexes the heat resistance of the complexes increases significantly. |
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| Keywords: | phenol-formaldehyde resin sodium borate complex thermocuring heat resistance |
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