Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation |
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| Authors: | Tong Hong Wang Te-Hua Fang Yu-Cheng Lin |
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| Institution: | (1) Department of Engineering Science, National Cheng Kung University, Tainan, 701, Taiwan, R.O.C.;(2) Thermal Laboratory, Advanced Semiconductor Engineering, Inc., Kaohsiung, 811, Taiwan, R.O.C.;(3) Institute of Mechanical & Electromechanical Engineering, National Formosa University, Yunlin, 632, Taiwan, R.O.C. |
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| Abstract: | Finite-element analysis of the nanoindentation into Au/Cu and Cu/Au multilayers was performed to deduce their mechanical characteristics
from nanoindentation response. Different bilayer thicknesses, numbers, and sequences were studied using the load–displacement
curve, hardness, indentation, and the residual surface profile as well as the von Mises equivalent stress. The characteristics
of the multilayers were found to be dispersed between the Au and Cu. Nevertheless, if the indentation depth is smaller than
the uppermost individual layer thickness of the multilayers, the intrinsic properties can be obtained. Using the von Mises
equivalent stress as a failure criterion, the results showed that thinner multilayers would induce a greater potential of
shear banding deformation.
PACS 61.43.Bn; 62.20.-x; 68.03.Hj; 68.05.Cf; 68.08.De |
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