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Improved electromigration reliability of Cu films by doping and interface engineering |
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| Authors: | Mei Xia Xiao Yong Fu Zhu Qing Jiang |
| Institution: | 1. Department of Chemistry, Capital Normal University, Beijing 100048, China;2. The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China;3. Beijing Key Laboratory for Terahertz Spectroscopy and Imaging, Key Laboratory of Terahertz Optoelectronics, Ministry of Education, Department of Physics, Capital Normal University, Beijing 100048, China;4. Daxing High School Attached to CNU, Beijing 102600, China |
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