Extremely high-aspect-ratio patterns in macroporous substrate by focused-ion-beam etching: the realization of three-dimensional lattices

We show the very particular behavior of focused-ion-beam etching in macroporous silicon. We demonstrate that, contrary to bulk samples, a porous substrate allows extremely high-aspect-ratio patterns to be etched at submicrometer scales. Thanks to the pre-introduced porosity, the secondary effects that limit the pattern depth in bulk-sample etching, namely the sputtered material redeposition as well as the beam ‘self-focusing’ effects, are strongly reduced in a porous sample. In this case the walls between the pores are sputtered in an almost independent way. The etching of deep and straight patterns is feasible. Combined with photoelectrochemical etching that generates the initial macropores, three-dimensional (3D) lattices can be obtained, as demonstrated by 3D photonic crystal fabrication. Received: 21 August 2002 / Accepted: 21 August 2002 / Published online: 12 February 2003 RID="*" ID="*"Corresponding author. Fax: +33-1/6915-6086, E-mail: wang@lps.u-psud.fr